Membrane Switch with Copper Flex Circuit

What is Flexible Printed Circuit(FPC) ?

A Flexible Printed Circuit (FPC) is a type of electronic circuit made on a flexible plastic substrate, typically polyimide or polyester. Unlike traditional rigid PCBs, FPCs can bend and fold, enabling compact and complex designs. They consist of conductive copper traces etched onto the substrate, with a protective coverlay. FPCs offer advantages such as space saving, durability, and better heat dissipation. They are widely used in consumer electronics, automotive, medical devices, aerospace, and industrial equipment for their lightweight, flexible, and resilient nature. This makes them ideal for applications requiring reliable performance in confined or dynamic environments.

What are the Advantages of Membrane Switch?

Flexibility: They can be bent, folded, and twisted without breaking, allowing for more compact and complex designs.

Space Saving: FPCs can be designed to fit into tight spaces and around curves, reducing the overall size and weight of electronic devices.

Durability: Resistant to vibration and movement, which is beneficial in high-motion environments.

Heat Dissipation: Better thermal management due to the thin, flexible nature of the material.

High Density:  Supports complex and high-density circuitry, enabling more functionality in a smaller area.

Structure and Composition

Substrate: The base material is usually a flexible polymer film such as polyimide or polyester, which provides the necessary flexibility and heat resistance.

Conductive Layers: Copper foil is laminated onto the substrate and then etched to form the circuit patterns. The copper can be single-sided, double-sided, or multi-layered.

Coverlay: A protective layer, often made of a similar polymer, covers the conductive traces to insulate and protect them from environmental damage.

Types of Flexible Circuits

Single-Sided Flex Circuits: Contain one layer of conductive material and are the simplest form.

Double-Sided Flex Circuits: Have conductive materials on both sides of the substrate with via connecting the two sides.
Multi-Layer Flex Circuits: Comprise multiple layers of conductors separated by insulating layers.

Rigid-Flex Circuits: Combine rigid and flexible circuit board technologies to create a single unit that provides both rigid and flexible sections.

Specifications of FPC

*The information & specification are for reference only